Highlights from IoT Tech Expo North America 2026

Highlights from IoT Tech Expo North America 2026 As connected products become smarter, smaller, and ...

Highlights of Sensors Converge 2026

The future of intelligent electronics is becoming smaller, faster, smarter, and more connected — and...

SATELLITE 2026: Featured Innovators Driving the Future of Space and Connectivity

SATELLITE 2026 brought the global satellite, space, defense, and communications industries to Washin...

How Flex PCBs Are Shielded for EMI and RFI Protection

Electromagnetic interference (EMI) and radio frequency interference (RFI) can disrupt signal quality...

Highlights from MD&M WEST 2026

MD&M West 2026 in Anaheim brought together medtech, automation, design/manufacturing, plastics, ...

Flexible Circuits Powering the Next Generation of Drones

Modern drones demand electronic systems that are lightweight, compact, and highly reliable. Traditio...

Guide to PCB & FPC Manufacturing Processes

This blog is an excerpt from the white paper Guide to PCB & FPC Manufacturing Processes: Subtrac...

Why Flexible PCBs Cost More: Top FPC Cost Drivers & How to Reduce Them

Flexible PCBs cost more than rigid PCBs, but the reasons vary widely. Material selection, stack-up s...

Designing Ultra-Thin Flexible Circuits: How to Prevent Cracks, Wrinkles, and Delamination

Ultra-thin flexible circuits enable compact designs, but they also introduce new failure risks. Thin...

Ultra-Thin Flex Circuits: Conductor Selection, Adhesiveless Copper, and Bend Reliability

Ultra-thin flexible circuits are only reliable when the conductor material and thickness are careful...

Controlled Impedance in Printed Circuit Board Design

In the design of printed circuit boards (PCBs), controlling impedance is a crucial factor for ensuri...

Optimizing Flexible Circuit Design: Advanced Strategies Part 2

In the continuation of our series on optimizing flexible circuit designs, we delve into additional c...

Optimizing Design for Flexible Circuits: Best Practices and Considerations Part 1

Flexible circuits are essential in today’s compact, lightweight devices—thanks to their ability to b...

Guidelines for Consigning Components and PCBs to PICA

At PICA Manufacturing Solutions, we occasionally receive printed circuit boards (PCBs) and/or compon...

Essential Documentation for Manufacturing Bare PCBs and FPCs

When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Fl...

Essential Documentation and Data Files for PCB Component Assembly

When ordering component assembly for your Printed Circuit Boards (PCBs) and Flexible Printed Circuit...

Advanced Soldering Techniques for PCB Assembly Success

What are Advanced Soldering Techniques in PCB Assembly? Soldering is a critical process that involve...

Advanced Surface Finishes for Enhanced PCB Performance

This blog is an introduction to a white paper that contains additional information on surface finish...

Exploring Adhesives in Flexible Printed Circuit Production

The production of flexible printed circuits (FPCs) relies heavily on various types of adhesives to e...

Enhancing Flexible Printed Circuit Performance: Stiffeners Guide

Stiffeners are essential for providing mechanical support to flexible circuits, particularly in area...