What to Look for in a Manufacturing Company in Malaysia

When evaluating a manufacturing company in Malaysia, most teams are focused on a few essentials: cap...

LPI Solder Mask vs. Polyimide Coverlay: Choosing the Right Protection for Flexible Circuits

See What You Can’t See: AOI & X‑Ray Inspection in PCB Assembly

In today’s electronics world, component densities are rising, geometries are shrinking, and reliabil...

Rigid-Flex: The Winning Technology Behind Smart Impact Monitoring Mouthguards

Next-Generation Wearable Health Monitoring: Polymer Thick Film Electronics and Biosensor Patches

Designing for Edge-Mounted PCBs: Best Practices and Considerations

Roll-to-Roll Processing: Driving the Next Generation of Flexible Circuits

Metal Core PCBs (MCPCBs): Thermal Muscle for High-Power Electronics

Compact Power, Cooler Systems: The Case for Ceramic PCBs in Modern Electronics

Hybrid Flex PCB Assemblies: Combining Technologies for Smarter Designs

Using Flex Circuits to Design Smaller, Smarter Electronics: The Smartphone Advantage

Environmental Resilience in Flex PCB Design

Biocompatible Substrates for Flex and Rigid PCBs

Best Practices for Grounding, Enclosure-Level Shielding, and Cable Shielding

Advanced Trace Routing Techniques for Flexible PCBs: Boost Reliability and Performance

Mastering Thermal Management in Flex PCB and Rigid PCB Design

Designing for Precision: Controlled Impedance in Flexible Circuits

As electronic devices shrink and signal speeds increase, one design requirement becomes mission-crit...

Designing for HDI PCB and Fine-Line Etching: What You Need to Know

As devices shrink and performance demands grow, engineers are turning to High-Density Interconnect (...

Explore Flexible Circuit Design with the PICA Flex Sample Kit

Designing flexible circuits isn’t just about choosing the right materials, it’s about understanding ...

Guide to PCB & FPC Manufacturing Processes

This blog is an excerpt from the white paper Guide to PCB & FPC Manufacturing Processes: Subtrac...