See What You Can’t See: AOI & X‑Ray Inspection in PCB Assembly

In today’s electronics world, component densities are rising, geometries are shrinking, and reliabil...

Why AOI and Quality Control Matter in PCB and Flex PCB

Why AOI and Quality Control Matter in PCB and Flex Circuit Manufacturing When it comes to PCB and fl...

Flex-Circuit Electrical Testing: Ensure PCB Reliability with Key Tests

Electrical Testing for Flex Circuits: How Engineers Confirm Performance & Reliability

Electrical testing is how engineers validate that every trace, interconnect, and layer transition fu...

High-Frequency Signal Insertion Loss

Development Needs for High-Frequency Signals

Ensuring PCB Integrity: The Vital Role of Surface Cleanliness

The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses che...

4 factors that can cause voiding in Ball Grid Arrays (BGA)

Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing indus...

Process Time vs Cycle Time in PCB Manufacturing: What Engineers Should Measure and Why

In PCB and flex manufacturing, understanding the difference between process time and cycle time is e...

X-Ray Inspection in PCB Assembly — What It Detects, Prevents, and Guarantees

X-ray inspection exposes hidden defects in solder joints, BGAs, vias, and internal connections that ...

OMRON AOI

We are thrilled to announce that our team at PICA has successfully completed a 5-day training progra...