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MD&M West 2026 in Anaheim brought together medtech, automation, design/manufacturing, plastics, and packaging, so the biggest trend wasn’t one product. It was how fast devices are becoming smarter, smaller, and more integrated, with more pressure on reliability, speed-to-market, and manufacturability.
Automation and motion systems keep getting smaller and more precise
Robotics, motion control, and factory automation were strong themes again, focused on compact footprints, faster cycles, and better repeatability. Featured companies included DENSO Robotics, Actuonix Motion Devices, and AIR – Automated Industrial Robotics.
Explore how PICA’s flex PCB capabilities help turn next-generation product concepts into production-ready designs.
Sensing + measurement is driving better control and smarter devices
Across medtech and industrial workflows, exhibitors like KEYENCE leaned into higher-resolution sensing and tighter feedback loops (measure → decide → act).
Additive and micro fabrication feel less future and more production-ready
More conversations centered on how additive manufacturing and micro fabrication are being used beyond prototyping, especially for complex geometries and specialized parts. Companies like 3D MicroPrint GmbH stood out for micro-scale manufacturing.
The electronics and interconnect ecosystem remains the quiet backbone
Even though MD&M isn’t an electronics-only event, the exhibitor mix reflected how essential electronics are to modern devices. Companies like Amphenol, Benchmark Electronics, and ams OSRAM stood out as part of the innovation-powered-by-electronics ecosystem.
How Flex + Rigid PCBs enable what MD&M is showcasing
Nearly every theme above is limited by the same constraint: electronics must do more while taking up less space and they must survive tougher environments. That’s where flex, rigid-flex, and advanced rigid PCBs keep enabling the next wave of products:
• Miniaturization: higher density routing and compact packaging for tight assemblies
• Dynamic flex: replacing bulky harnessing in moving sections, joints, and compact modules
• Environmental durability: designs and materials built for heat, cold, chemicals, and vibration
• EMI shielding and signal integrity: keeping sensors, comms, and mixed-signal systems stable in noisy environments
MD&M West 2026 reinforced a clear direction: smarter sensing, tighter automation, more integrated assemblies, and more production-ready advanced manufacturing, all pushed forward by the supporting ecosystem of electronics and interconnects. The companies that stood out weren’t just showing “cool tech,” they were showing how to build the next generation of devices faster, smaller, and more reliably.
Discover how PICA’s rigid-flex capabilities helps power next-generation designs.