In the continuation of our series on optimizing flexible circuit designs, we delve into additional c...
Flexible circuits' ability to bend, twist, and flex makes them ideal for modern devices where space ...
Soldering is a critical process that involves joining electronic components to printed circuit board...
Development Needs for High-Frequency Signals
This blog is an introduction to a white paper that contains additional information on surface finish...
Stiffeners are essential for providing mechanical support to flexible circuits, particularly in area...
PCBAs (Printed Circuit Board Assemblies) and FPCAs (Flexible Printed Circuit Assemblies) are both in...
This blog is an introduction to a larger white paper that features 7 different via protection types....
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing indus...
Hand Soldering of Components with High Thermal Mass.
Why Do Flex PCB Delaminate in High Temperature Exposure?
Component Engineers: The Heart of Product Design and Assembly - The role of a Component Engineer (CE...
The Rise of Ceramic Substrate PCB Ryan Hu 2024-01-10T19:36:33+00:00 By Ryan Hu
In the fast-paced realm of the PCB (Printed Circuit Board) industry, achieving optimal signal integr...
At PICA, we pride ourselves on being at the forefront of new technological advancements, including e...
A 6-Layer ELIC (Every Layer Inter-connect) Rigid-Flex PCB is an advanced and highly specialized prin...
The most obvious benefit to a Flexible Printed Circuit (FPC) is the ability to bend and flex in orde...
In the mid-1990s, the landscape of electronic manufacturing in the United States was thriving. The r...
So you need a flex circuit but your application demands a black substrate to keep the light out? The...
