Enhancing Polyimide Surface Properties for Superior Bonding in Flexible Printed Circuits Mark Pare Apr 11, 2024 2:18:48 PM The general scope of this article is to discuss methods for treating and characterizing the surface ... Read more
Hand Soldering of Components with High Thermal Mass Mark Pare Mar 5, 2024 1:09:47 PM Hand Soldering of Components with High Thermal Mass. Read more
Preventing the Delamination of Your Flex Circuitry in the Soldering Reflow Process Mark Pare Feb 27, 2024 11:22:33 AM Why Do Flex PCB Delaminate in High Temperature Exposure? Read more