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Essential Documentation for Manufacturing Bare PCBs and FPCs
When placing an order with PICA Manufacturing Solutions for bare Printed Circuit Boards (PCBs) or Fl...
Essential Documentation and Data Files for PCB Component Assembly
When ordering component assembly for your Printed Circuit Boards (PCBs) and Flexible Printed Circuit...
Advanced Soldering Techniques for PCB Assembly Success
Soldering is a critical process that involves joining electronic components to printed circuit board...
Advanced Flexible Circuit Solder Coating
Customer: A leading innovator in inkjet technology, our customer is renowned for their advanced and ...
Pick a Partner, Not Parts: The Human Side of Engineering
In today's digital age, many companies rely solely on online transactions, often without giving you ...
Advanced Surface Finishes for Enhanced PCB Performance
This blog is an introduction to a white paper that contains additional information on surface finish...
Exploring Adhesives in Flexible Printed Circuit Production
The production of flexible printed circuits (FPCs) relies heavily on various types of adhesives to e...
Enhancing Flexible Printed Circuit Performance: Stiffeners Guide
Stiffeners are essential for providing mechanical support to flexible circuits, particularly in area...
PCBA vs. FPCBA: Understanding the Differences
PCBAs (Printed Circuit Board Assemblies) and FPCAs (Flexible Printed Circuit Assemblies) are both in...
Flexible Printed Circuit (FPC) Dielectric Materials: Choosing the Best for Your Application
At PICA Manufacturing Solutions (PMS), we specialize in creating Flexible Printed Circuits (FPCs) th...
Selecting the Best Copper Conductor for PCBs and Flexible Circuits
When it comes to choosing the right conductor material for flexible printed circuits (FPC), the prim...
The PICA Principles of Carbon Copy: Mastering Technology Transfer
Over the years, PICA Manufacturing Solutions (PICA) has not only mastered the art of supporting cust...
Printed Circuit Board (PCB) Via Protection: Strategies and Standards
This blog is an introduction to a larger white paper that features 7 different via protection types....
Enhancing Polyimide Surface for Superior Bonding in Flex Circuits
The general scope of this article is to discuss methods for treating and characterizing the surface ...
Ensuring PCB Integrity: The Vital Role of Surface Cleanliness
The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses che...
Unlocking Opportunities: Pinkerton Academy & PICA Partnership
Pinkerton Academy, having a storied legacy of over 200 years, goes beyond the conventional role of a...
4 factors that can cause voiding in Ball Grid Arrays (BGA)
Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing indus...
Enhancing Connector Performance: PICA's PEEK Solution
A leading company specializing in high-power semiconductor and fiber lasers for diverse applications...
Hand Soldering of Components with High Thermal Mass
Hand Soldering of Components with High Thermal Mass
