Exploring Adhesives in Flexible Printed Circuit Production

The production of flexible printed circuits (FPCs) relies heavily on various types of adhesives to e...

Enhancing Flexible Printed Circuit Performance: Stiffeners Guide

Stiffeners are essential for providing mechanical support to flexible circuits, particularly in area...

PCBA vs. FPCBA: Understanding the Differences

PCBAs (Printed Circuit Board Assemblies) and FPCAs (Flexible Printed Circuit Assemblies) are both in...

Flexible Printed Circuit (FPC) Dielectric Materials: Choosing the Best for Your Application

At PICA Manufacturing Solutions (PMS), we specialize in creating Flexible Printed Circuits (FPCs) th...

Selecting the Best Copper Conductor for PCBs and Flexible Circuits

When it comes to choosing the right conductor material for flexible printed circuits (FPC), the prim...

The PICA Principles of Carbon Copy: Mastering Technology Transfer

Over the years, PICA Manufacturing Solutions (PICA) has not only mastered the art of supporting cust...

Printed Circuit Board (PCB) Via Protection: Strategies and Standards

This blog is an introduction to a larger white paper that features 7 different via protection types....

Enhancing Polyimide Surface for Superior Bonding in Flex Circuits

The general scope of this article is to discuss methods for treating and characterizing the surface ...

Ensuring PCB Integrity: The Vital Role of Surface Cleanliness

The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses che...

Unlocking Opportunities: Pinkerton Academy & PICA Partnership

Pinkerton Academy, having a storied legacy of over 200 years, goes beyond the conventional role of a...

4 factors that can cause voiding in Ball Grid Arrays (BGA)

Ball Grid Arrays (BGAs) are crucial components widely employed in the electronic manufacturing indus...

Enhancing Connector Performance: PICA's PEEK Solution

A leading company specializing in high-power semiconductor and fiber lasers for diverse applications...

Hand Soldering of Components with High Thermal Mass

Hand Soldering of Components with High Thermal Mass

Preventing Flex Circuit Delamination During Soldering and Reflow

Why Do Flex PCB Delaminate in High Temperature Exposure?

The Strategic Importance of Component Engineers at PICA

Component Engineers: The Heart of Product Design and Assembly - The role of a Component Engineer (CE...

Low-Profile FFC Solutions for Smart Gas Metering & IoT Devices

Utility and gas metering systems are becoming smaller, smarter, and more integrated with IoT connect...

Celebrating the 2024 Lunar New Year

As we celebrate the Lunar New Year, a time of hope and renewal embraced by millions around the world...

Process Time vs Cycle Time in PCB Manufacturing: What Engineers Should Measure and Why

In PCB and flex manufacturing, understanding the difference between process time and cycle time is e...

Case Study: PICA’s Advanced Filter Tester Success Story

The Customer: A renowned multinational company, well known for its pioneering work in imaging and ph...

PICA at Tech Venture Meetup 2024: Innovation & Collaboration

PICA Manufacturing Solutions Malaysia (PMSM) Shines at Tech Venture Meetup 2024 Pascal Delloue 2024-...