Enhancing Polyimide Surface for Superior Bonding in Flex Circuits

The general scope of this article is to discuss methods for treating and characterizing the surface ...

Preventing Flex Circuit Delamination During Soldering and Reflow

Why Do Flex PCB Delaminate in High Temperature Exposure?

Flexible Printed Circuits: PICA’s Expertise in Material Selection

Flexible Printed Circuits: PICA’s Expertise in Material Selection Simon Lim 2024-01-09T18:18:51+00:0...

The Power of Embedded Passives

At PICA, we pride ourselves on being at the forefront of new technological advancements, including e...

X-Ray Inspection in PCB Assembly — What It Detects, Prevents, and Guarantees

X-ray inspection exposes hidden defects in solder joints, BGAs, vias, and internal connections that ...

Relief Slots: An effective solution to prevent FPC damage during installation

The most obvious benefit to a Flexible Printed Circuit (FPC) is the ability to bend and flex in orde...