The PICA Principles of Carbon Copy: Mastering Technology Transfer

Over the years, PICA Manufacturing Solutions (PICA) has not only mastered the art of supporting cust...

Ensuring PCB Integrity: The Vital Role of Surface Cleanliness

The production of Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs) encompasses che...

Hand Soldering of Components with High Thermal Mass

Hand Soldering of Components with High Thermal Mass

Preventing Flex Circuit Delamination During Soldering and Reflow

Why Do Flex PCB Delaminate in High Temperature Exposure?

Process Time vs Cycle Time in PCB Manufacturing: What Engineers Should Measure and Why

In PCB and flex manufacturing, understanding the difference between process time and cycle time is e...

X-Ray Inspection in PCB Assembly — What It Detects, Prevents, and Guarantees

X-ray inspection exposes hidden defects in solder joints, BGAs, vias, and internal connections that ...

The DFM (Design For Manufacturing) Dilemma

In the mid-1990s, the landscape of electronic manufacturing in the United States was thriving. The r...

Mastering Reflow Soldering in PCB Assembly

Despite an abundance of literature about oven reflow soldering, PICA has found that setting up a ref...