Modern electronics are expected to run hotter, switch faster, and survive harsher environments than ever. Standard FR-4 hits its limits quickly in these scenarios. Ceramic printed circuit boards (PCBs) step in with exceptional thermal conductivity, electrical insulation, and mechanical stability, enabling compact, long-life designs in power, RF/microwave, aerospace/defense, and heavy industrial markets.
PICA Manufacturing Solutions designs and manufactures ceramic PCB assemblies using aluminum oxide (Al₂O₃), aluminum nitride (AlN), and silicon nitride (Si₃N₄).
From prototypes to volume production—and from pure ceramic builds to hybrid ceramic + metal-core or rigid-flex architectures—we align material choice, stackup, and manufacturing to your electrical, thermal, and mechanical goals.
Why Choose Ceramic PCBs?
• Thermal Conductivity: Ceramics pull heat away from junctions far more effectively than FR-4, supporting high-power LEDs, drivers, and power converters.
• Reliability in Harsh Environments: Low coefficients of thermal expansion (CTE) and corrosion resistance help boards stay dimensionally stable under shock, vibration, and extreme temperatures.
• High-Frequency Performance: Low dielectric loss and high breakdown voltage enable efficient RF/microwave and high-voltage designs.
• Compact Design Potential: Dense interconnects, embedded passives, and hybrid configurations reduce footprint while raising performance.
• Long-Term Durability: Excellent resistance to chemical, mechanical, and thermal stress extends field life in critical systems.
Where Ceramic PCBs Shine (Applications & Markets)
Power Electronics & High Voltage
• DC-DC/AC-DC conversion, motor drives, inverters, solid-state relays, battery management, e-mobility power stages.
• Stable isolation and strong heat spreading directly under MOSFETs, IGBTs, GaN/SiC devices.
RF, Microwave & Millimeter-Wave
• Low-loss interconnects for amplifiers, LNAs, PAs, filters, radar front ends, and phased arrays.
• Predictable dielectric properties across temperature for tight phase/noise budgets.
Lighting & Photonics
• High-power LED engines (white/UV/IR), light bars, medical/industrial illumination where thermal resistance and reflectivity matter.
Aerospace, Defense & Harsh Industrial
• Down-hole tools, avionics, radar, actuation systems, high-G environments—where vibration, temperature cycling, and reliability are non-negotiable.
Sensing & Instrumentation
• Pressure/flow/chemical sensors, precision analog, and high-stability timing where CTE and moisture resistance drive stability.
Ceramic Materials—Picking the Right Substrate
• Alumina (Al₂O₃): The workhorse ceramic—excellent electrical insulation (insulation strength 20KV/mm), strong mechanical properties, and good value.
• Aluminum Nitride (AlN): Very high thermal conductivity (>=170 W/(m·K)) with good electrical insulation—ideal for high-power density and fast thermal transients.
• Silicon Nitride (Si₃N₄): Outstanding fracture toughness (Bending Strength 600~700MPa) and thermal shock resistance—favored where mechanical robustness is paramount (e.g., automotive power modules).
Material choice is a system decision: target thermal resistance (junction-to-case/board), voltage standoff, package mechanics, and cycling profile to select the best ceramic for the job.
Ceramic PCB Stackups & Build Styles
Ceramic is not a single process—several metallization and lamination approaches exist. PICA supports the major families and helps you select the right one.
1) Thick-Film & Thin-Film on Ceramic
• Thick-film (Thick Printing Ceramic Substrate (TPC), e.g., Ag, Ag-Pd, Au pastes; typical thickness 10~20μm) screen-printed and fired on ceramic; robust for power and hybrid circuits.
• Thin-film (Thin Film Ceramic Substrate (TFC), e.g., sputtered TiW/Cu/Au; typical thickness <10μm, most <1μm) for precision RF/microwave lines and tight tolerances -
• Pros: Excellent dimensional stability; configurable conductor/resistor networks; good for hybrids.
• Use cases: RF modules, sensor substrates, precision analog, LED modules, hybrid microelectronics.
2) DBC / AMB (Direct-Bonded Copper / Active-Metal Brazed)
• DBC: Copper directly bonded to ceramic (commonly Al₂O₃, AlN). High thermal conductivity path from device to copper to ceramic.
3) Multilayer Ceramics (HTCC / LTCC)
• HTCC (High-Temp Co-Fired Ceramic): Layers of ceramic tapes with metallization (W/Mo/Mn) co-fired at high temperature (1600 - 1800℃)—durable and hermetic-capable.• Use cases: RF front ends, compact sensor modules, high-reliability hybrid packages.
4) Hybrid Ceramic Stacks
• Ceramic + FR-4 or Rigid-Flex: Put hot or RF-critical sections on ceramic; host logic/connectivity on FR-4 or rigid-flex; bridge with flex/FFC.
• Ceramic + Metal-Core (MCPCB): Combine ceramic topography with an underlying metal core when mechanical or mounting constraints favor IMS.
• Pros: Best-of-both-worlds performance without over-engineering the whole assembly.
• Use cases: Mixed power/control boards, RF/power combos, compact modules with challenging thermals.
Manufacturing & DFM Considerations (What to Plan Up Front)
Metallization & Finish
• Select conductor system for your environment and process (e.g., Au thick-film for wire-bonding, Cu for high current).
• Surface finishes: ENIG/ENEPIG on plated copper; Au on thick-film for bond pads and solderability.
Layers & Interconnect
• DBC/AMB: Typically 1-2 copper layers per ceramic tile; routing uses etched copper; through-ceramic vias are not used like FR-4.
• HTCC/LTCC: True multilayer with vias created during tape processing—great for miniaturization and embedded passives.
• Hybrid builds: Plan interface pads and mechanical datum features for clean handoffs to flex/rigid or metal-core.
Thermal Path Engineering
• Place power devices directly over large copper pads tied into the ceramic; use short, wide traces and solid copper pours.
• If coupling to a chassis or cold plate, specify backside flatness and TIM (thermal interface material) choices early.
Mechanical Features
• Define slots, chamfers, and keep-outs during substrate fab—ceramic machining is precise but not an afterthought.
• For high-G or vibration, add mounting features that spread load and avoid stress risers at edges.
Assembly Profiles
• Ceramic substrates change thermal mass and heat flow; tune reflow to ensure wetting on large copper pads without overheating fine features.
• For high power, evaluate press-fit, wire-bond, or clip-bond attachment to manage current and thermal rise.
Test & Reliability
• Specify hipot across dielectric, thermal cycling/soak, and powered thermal tests.
• For RF, include S-parameter targets; for power, define ΔT, RθJB/RθJC goals, and acceptable junction temps.
Bring Ceramic Into Your Next Design—Without Compromise
Whether you’re trying to cool a dense SiC power stage, stabilize a sensitive RF front end, or package a rugged module for aerospace/industrial duty, ceramics provide the physical properties that FR-4 can’t. PICA will help you choose the right substrate and stackup, validate the thermal and electrical model, and build a production-ready assembly that meets your performance and cost targets.
Ready to explore ceramic PCBs?
Share your outlines, thermal/electrical targets, and environment. We’ll propose a ceramic (or hybrid) architecture with lead-time, cost, and reliability options—then take it from proto to production.