At PICA Manufacturing Solutions, we believe the future of electronics is not built component by component, it is engineered as a fully integrated system.
As products become smaller, more functional, and more design-driven, the traditional model of separating electrical, mechanical, and assembly processes across multiple suppliers is no longer efficient. It introduces risk, slows development, and limits innovation.
That’s why PICA focuses on delivering integrated manufacturing solutions, bringing together Flexible Printed Circuits (FPC), FPC assembly, and injection molding into a seamless, turnkey approach.
Many manufacturers can supply individual technologies. Few can truly integrate them.
At PICA, our role is to bridge that gap, connecting advanced manufacturing capabilities into a cohesive solution that simplifies complexity for our customers.
This integration allows us to support customers not just at the sourcing level, but at the design, engineering, and system optimization level.
Flexible Printed Circuits (FPC): Enabling Design Freedom
FPCs allow circuits to bend, fold, and conform to complex geometries, making them ideal for compact and space-constrained applications.
They enable:
• Miniaturization of electronic systems
• Dynamic applications (hinges, wearables, moving parts)
• Efficient use of limited space
At PICA, we work with customers early to ensure FPC designs are optimized not just electrically but also from a mechanical and manufactural standpoint.
Assembling components onto flexible substrates requires specialized expertise. Material behavior, thermal management, and handling all differ significantly from rigid PCB assembly.
By integrating assembly into the solution, PICA enables:
• High-density, compact electronic systems
• Integration of sensors, connectors, and active components
• Improved alignment between design intent and final product
This ensures that the flexible circuit is not just a connector, but a fully functional subsystem.
Injection molding transforms mechanical design into a functional part of the electronic system.
When combined with FPC and assembly, it enables:
• Overmolding of electronics for protection and durability
• Integration of circuits directly into plastic structures
• Creation of sealed, ergonomic, and lightweight designs
This is where electrical and mechanical engineering truly converge. Application example as below is a case of connector
By bringing these technologies together through our manufacturing partners and engineering expertise, PICA delivers clear advantages to our customers.
1. True Design Integration
We help customers rethink product architecture by eliminating unnecessary boundaries between components.
This leads to:
• Fewer connectors and interconnects
• More compact and efficient designs
• Greater freedom in industrial design
2. Enhanced Reliability
Every additional supplier and handling step introduces risk.
Through integrated solutions, PICA reduces:
• Mechanical stress on components
• Alignment and tolerance issues
• Potential failure points
The result is a more robust and dependable product.
3. Faster Time-to-Market
Speed matters.
With aligned processes and close collaboration between technologies, we enable:
• Faster prototyping cycles
• More efficient design iterations
• Reduced back-and-forth between vendors
4. System-Level Cost Optimization
Cost is not just about piece price, it’s about total system efficiency.
Our approach helps reduce:
• Assembly complexity
• Logistics and supply chain overhead
• Redesign costs from integration issues
5. New Levels of Product Functionality
The most exciting benefit is what becomes possible.
By combining FPC, assembly, and molding, PICA enables customers to achieve:
• Fully sealed and protected electronic systems
• Flexible and wearable designs
• Integrated sensing within structural components
• Lightweight, compact product architectures
The convergence of flexible circuits, advanced assembly, and precision molding is redefining modern product design.
By integrating these capabilities, PICA helps customers:
• Simplify complexity
• Accelerate development
• Improve reliability
• Unlock new product possibilities
This is not just manufacturing, it is engineering integration at its highest level.