Designing flexible circuits isn’t just about choosing the right materials, it’s about understanding how all the pieces come together under real-world demands. That’s why we created the PICA Flex Sample Kit, a hands-on tool that lets engineers explore different flex stack-ups, materials, and design strategies.
Each 1" x 5" sample in our kit is a functional showcase of a specific application need, from high-current handling to extreme flexibility. It’s more than a demo—it’s a conversation starter for your next breakthrough design.
See what’s inside the kit and how it can help your engineering team design smarter: Watch the video
A standard two-layer flex using 35 µm RA copper, built for limited bending during installation with rugged durability.
Made for repeated motion and 3D packaging, this stack-up uses thin RA copper and adhesiveless polyimide for added flexibility.
Flex When performance under continuous movement is non-negotiable, this ultra-thin construction with 2 µm HDED copper offers unmatched endurance.
Designed for power-intensive applications with 2 oz copper and reinforced film for stability under load.
Multi-layered with polyimide and copper shielding to preserve signal integrity across high-speed designs.
This flexible construction with EMI shielding film protects sensitive circuits in noisy environments.
• Standardized size makes it easy to test, compare, and handle in the lab.
• Custom-built samples show off real production capability, not generic demos.
• Accelerates prototyping by helping teams narrow down stack-up and layout needs early in the design cycle.
Ready to get your hands on one? Let’s talk about your next flex design challenge and how our engineering team can support you, from prototype to production.