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CES 2026 Highlights: The Breakthrough Technologies Powered by Advanced Flex & PCB Design

Written by Pascal Delloue | Jan 27, 2026 4:56:35 PM

Las Vegas, January 2026, CES 2026 once again confirmed that the pace of innovation in consumer tech, mobility, AI, and robotics isn’t slowing down. With over 4,000 exhibitors and thousands of breakthrough products on the show floor, this year’s CES put a spotlight on technologies that feel like they’re straight out of tomorrow, from AI‑powered devices and autonomous vehicles to ultra‑thin displays and interactive smart systems.

But behind every cutting‑edge gadget and futuristic concept lies something less flashy, the flex and rigid circuitry that makes it all work. In this post, we’ll explore the top tech trends from CES 2026 and explain why rigid and flexible printed circuit technologies are increasingly at the backbone of next‑generation innovation.


Product Spotlight and Awards

Awards coverage at CES 2026 spotlighted standout products across robotics, smart home, displays, and wearables—many of which hinge on ultra-compact packaging and reliable interconnects. The Verge’s CES awards highlighted winners like LG Display’s 27-inch 4K RGB-stripe OLED panel (Best monitor), Corsair’s Galleon 100 SD (Best keyboard), TCL X11L SQD-Mini LED (Best TV), Asus ROG Zephyrus Duo (Best laptop), Aqara Smart Lock U400 (Best smart home device), Mercedes Drive Assist Pro (Best car), Withings Body Smart 2 (Best health tech), L’Oréal LED Face Mask (Best wearable), plus headline-grabbers like Lenovo’s Legion Pro Rollable and Samsung’s Galaxy Z TriFold—and it named Lego Smart Brick as Best in Show.  Engadget’s Best of CES coverage also called out SwitchBot Onero H1 as its Best robot, reinforcing the momentum behind motion-capable systems that demand durable electronics and smart internal routing.

On the official CES Innovation Awards® roster, notable 2026 award-recognized products include Hisense 163MX (shown with a 2026 Best of Innovation Award) and LG Display 16” Dual View OLED (listed as a 2026 award recipient in In-Vehicle Entertainment), alongside other honorees like Hisense Visual Technology Co., Ltd. 116UXS.  In beauty tech, L’Oréal also announced its LED Face Mask as a 2026 CES® Innovation Award honoree, underscoring how flexible, body-conformable consumer devices are accelerating—and why flex and rigid-flex circuitry is increasingly central to making these award-winning form factors manufacturable and reliable.

Key Trends from CES 2026

AI Everywhere

Artificial intelligence kept its breakout status at CES 2026, now embedded into devices across categories, from smart home systems learning routines to AR‑infused assistants and intelligent edge computing platforms.

Smart Home Gets Smarter
The smart home landscape incorporated deeper sensor integration, machine learning, and always‑connected responsiveness, pushing the need for compact electronics.

Robotics and Automation
Humanoids, service robots, and autonomous systems showed just how far electronics, AI, and mechanical design have evolved together.

Mobility & Autonomous Systems
Self‑driving platforms, advanced sensors, and real‑time processing defined the next wave of vehicle innovation — all relying on high‑reliability circuitry.

Interactive & Wearable Tech
Ultra‑thin displays, AR glasses, and wearables drove the need for miniaturized electronics and flexible interconnects.

Standout Products & Concepts
Rollable and creaseless displays
AI‑powered headsets and smart audio devices
Interactive toys and sensor‑rich smart play systems
Next‑generation home robots
Wearable health and beauty devices

Why Rigid & Flex Printed Circuitry Matters More Than Ever

Miniaturization & Form Factor Freedom
Foldables, wearables, and robotics rely on rigid‑flex circuits for high‑density, 3D interconnects.

High‑Performance Data & Power Transmission
AI devices require bandwidth‑dense and noise‑resistant HDI circuitry.

Durability in Extreme Use Cases
Automotive, robotics, and industrial applications all depend on flexible interconnects that can withstand vibration and motion.

Sensor & Component Integration
Modern smart devices embed sensors directly into circuitry, enabled by flex technologies.

CES 2026 showed that electronics are no longer background components — they are the backbone of innovation. As devices become smaller, smarter, and more connected, rigid and flex printed circuitry will continue enabling the future of mobility, AI, robotics, and everyday consumer technology.

Discover how PICA’s rigid-flex capabilities helps power next-generation designs.